||Investigation of segregation during oxidation of Ni–Cu alloy by in situ photoelectron spectroscopy
Doi, Takashi ,
Nishiyama, Yoshitaka ,
Yoshigoe, AkitakaTeraoka, Yuden
Surface and Interface Analysis
688 , 2017-02 , John Wiley & Sons Ltd
Ni-based alloys have been widely used for plant application because of their high strength and excellent oxidation resistance. In particular, the addition of Cu in Ni-based alloys significantly improves the metal dusting resistance. It is indicated that Cu is segregated on the alloy surface in the metal dusting environment; however, the details have not been clarified yet. The behavior of Ni–2Cu alloy under a high temperature oxidation environment was investigated using in situ X-ray photoelectron spectroscopy. It was confirmed that Cu has been segregated at the surface of Ni–2Cu alloy during oxidation. These results propose that the Cu segregation improves the metal dusting resistance.