Departmental Bulletin Paper 超音波振動を応用した次世代半導体ウエハーの精密研磨技術の開発(学内特別研究および国外研修)

神, 雅彦  ,  Masahiko, Jin

Description
Recently, a number of next generation superhard materials, such as binderless tungsten carbide, SiC ceramics, singlecrystalline SiC and sapphire, and diamond are used for molds, cutting tools and semiconductor substrate. Against the requirement, in order to improve the machining efficiency, we study on the application of ultrasonic -vibration to the abrasive processes. As a result of this study, we could show an effectiveness of ultrasonic vibration against the next generation superhard materials on machining efficiency and accuracy, and tool life.
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