Conference Paper Ultra-high Strength in Electroplated Nanocrystalline Au–Cu Alloys Evaluated by Micro-Compression Tests for MEMS Devices

陳, 君怡  ,  Chen, Chun Yi  ,  Tang, Hao-Chun  ,  Tang, Hao-Chun  ,  Chang, Tso-Fu Mark  ,  Chang, Tso-Fu Mark  ,  名越, 貴志  ,  Nagoshi, Takashi  ,  山根, 大輔  ,  Yamane, Daisuke  ,  小西, 敏文  ,  Konishi, Toshifumi  ,  町田, 克之  ,  Machida, Katsuyuki  ,  伊藤, 浩之  ,  Ito, Hiroyuki  ,  益, 一哉  ,  Masu, Kazuya  ,  曽根, 正人  ,  Sone, Masato

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