Conference Paper An RF Universal Board for SSOP Elements

高安, 基大  ,  Takayasu, Motohiro  ,  權田, 惇晟  ,  Gonda, Toshiaki  ,  石川, 洋介  ,  Ishikawa, Yosuke  ,  伊藤, 浩之  ,  Ito, Hiroyuki  ,  石原, 昇  ,  Ishihara, Noboru  ,  益, 一哉  ,  Masu, Kazuya

Proceeding of The 2015 International Conference on Integrated Circuits, Design, and Verification & The 2015 Vietnam-Japan MicroWave
pp.81 - 82 , 2015-08 , IEICE
Description
Conventional universal boards for testing and prototyping of circuits cannot be applied to RF measurement due to their poor frequency characteristics. This paper introduces a universal board for RF circuits that consist of surface mount type SSOP (Shrink Small Outline Package) elements. Metal lines and ground planes are regularly arranged so that ground-coplanar-waveguide-like structure is obtained, and implementation of an additional seal substrate for assembling an RF connector is presented. Examples of prototyping and measurement are shown, and frequency characteristics are discussed.

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