Numerical Simulation of Transient Heat Conduction Analysis in Laser Illuminated Area during SLM Process including Melting and Solidification of Powder Layer
池庄司, 敏孝 ,
京極, 秀樹 ,
米原, 牧子 ,
荒木, 正浩中村, 和也
近畿大学次世代基盤技術研究所報告 = Kindai University Research Institute of Fundamental Technology for Next Generation
94 , 2016-07 , 近畿大学次世代基盤技術研究所
The selective laser melting(SLM) is a kind of additive manufacturing processes, which melts the thin powder layer selectively and forms 3D object by compiling many layers. To obtain the proper laser melting conditions for SLM process, the prediction of thermal field around the scanning laser spot is necessary. In this paper, a finite element method of transient heat conduction analysis is proposed to predict the thermal field. It is based on the energy conservation equation for enthalpy of bulk metal, powder metal and once-melt-and-solidified powder metal. The method includes the phenomena of melting and solidification of powder metal. The numerical simulation using this method is applied for Ni-based refractory alloy, Inconel-718, and the results of the simulation is presented with temperature contours and dimensions of melt pool.