紀要論文 シミュレーテッドテンパリングによる電子部品実装順序の最適化
OPTIMIZATION OF ELECTRONIC COMPONENT MOUNTING ORDER BY SIMULATED TEMPERING

中村, 將人  ,  NAKAMURA, Masato

(56) 2015-03-24 , 法政大学大学院理工学・工学研究科
ISSN:2187-9923
NII書誌ID(NCID):AA12677220
内容記述
The problem of combinatorial optimization is to find the optimal solution from all feasible solutions. A typical example is the travelling salesman problem that belongs to a class called NP-complete problems. For these problem,simulated annealing and simulated tempering are very effective and practical algorithms. In this study, the performance of simulated annealing was compared with that of simulated tempering through the optimization of the electronic component mounting order. The validity of simulated tempering was demonstrated via numerical experimentation.
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http://repo.lib.hosei.ac.jp/bitstream/10114/10549/1/13R4121.pdf

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