||Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder
Nishikawa, HiroshiMokhtari, Omid
22 , 2015-12 , 大阪大学接合科学研究所 , Joining and Welding Research Institute, Osaka University , オオサカ ダイガク セツゴウ カガク ケンキュウジョ
A comparative analysis between the microstructure and the tensile properties of eutectic Sn-Bi,(Sn-Bi)-0.5In,and (Sn-Bi)-1In solder alloys was conducted. Tensile tests were performed on bulk solder alloys, followed by post-test fracture surface analysis. The results of the tensile tests indicated that the addition of In is highly effective in improving the ductility of the SN-Bi solder alloys. Moreover, on increasing the In content from 0.5 to 1wt.%, the elongation of the Sn-Bi solder alloy exhibited a significant increase. In addition, the dimple-like structure on the fracture surfaces of the tensile tested In-bearing solder alloys indicated the ductile properties of the alloys.