紀要論文 Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder

Mokhtari, Omid  ,  Nishikawa, Hiroshi

44 ( 2 )  , pp.19 - 22 , 2015-12 , 大阪大学接合科学研究所 , オオサカ ダイガク セツゴウ カガク ケンキュウジョ , Joining and Welding Research Institute, Osaka University
ISSN:03874508
NII書誌ID(NCID):AA00867058
内容記述
A comparative analysis between the microstructure and the tensile properties of eutectic Sn-Bi,(Sn-Bi)-0.5In,and (Sn-Bi)-1In solder alloys was conducted. Tensile tests were performed on bulk solder alloys, followed by post-test fracture surface analysis. The results of the tensile tests indicated that the addition of In is highly effective in improving the ductility of the SN-Bi solder alloys. Moreover, on increasing the In content from 0.5 to 1wt.%, the elongation of the Sn-Bi solder alloy exhibited a significant increase. In addition, the dimple-like structure on the fracture surfaces of the tensile tested In-bearing solder alloys indicated the ductile properties of the alloys.
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http://ir.library.osaka-u.ac.jp/dspace/bitstream/11094/57271/1/jwri44_2-019.pdf

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