||Interfacial Structure Analysis on Direct Bonding Metals to Plastics
Imai, Hisashi ,
Kondoh, Katsuyoshi ,
Izawa, TakeruUmeda, Junko
26 , 2015-06 , 大阪大学接合科学研究所 , オオサカ ダイガク セツゴウ カガク ケンキュウジョ , Joining and Welding Research Institute, Osaka University
This research investigated the direct bonding mechanism of dissimilar materials such as metals and palstic by the conventional hot pressing process. The press area of 4x4mm2 was used for direct bonding. The results of the study showed that titanium was completely bonded to polyamide 66. On the other hand, titanium was not bonded to polystyrene. In the case of bonding material of titanium with polyamide 66, and oxide layer of about 20nm as reaction layer was confirmed on the bonding interface by transmission electron misroscope obvervation. It was considered that the origin of this oxide layer was due to oxygen constituting amide groups with C=O double bond in the polyamide 66.