Journal Article Engineering and characterization of a packaged high-T c superconducting terahertz source module

Tsujimoto, Manabu  ,  Doi, Takuji  ,  Kuwano, Genki  ,  Elarabi, Asem  ,  Kakeya, Itsuhiro

30 ( 6 )  , p.064001 , 2017-05 , IOP Publishing
We present an effective engineering technique for compactly packaging high-T c superconducting continuous-wave terahertz source modules. A terahertz-emitting device, which consists of stacks of intrinsic Josephson junctions in single crystalline Bi2Sr2CaCu2O${}_{8+\delta }$, bias electrodes, a collimating lens, and other components, is packaged into a single finger-sized assembly. The rigid and stable structure used for the packaging guarantees physical and chemical stability with good thermal contact, and provides reproducible characteristics with a high yield rate. The coherent terahertz waves can be emitted from the back side of the base crystal without significant screening. The intuitive results obtained from the numerical simulation are consistent with the observed thermal properties. The modules are easy to use, and thus intended for all users unfamiliar with superconducting electronic devices.

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