||Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier
Suzuki, N. ,
Hashimoto, Y. ,
Yasuda, H. ,
Yamaki, S.Mochizuki, Y.
CIRP Annals - Manufacturing Technology
332 , 2017-06 , Elsevier
This paper presents a CMP process analysis considering an airbag type wafer carrier, which is used insemiconductor devices manufacturing. In the CMP process, a wafer is compressed against the polishingpad inside the wafer carrier, which consists of the retainer ring and the membrane film. Structuralanalysis model is developed to estimate contact pressure distribution over the wafer surface consideringthe airbag compression behaviour. The polishing experiment without wafer rotation indicated a uniquepressure variation around the trailing edge of the wafer. The developed analysis estimated the samephenomena accurately and clarified the mechanism deteriorating the polishing pressure uniformity.